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Microstructural and mechanical analysis of Cu and Au...

Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads

Anand, T. Joseph Sahaya, Yau, Chua Kok, Leong, Yeow See, Keat, Lim Weng, Ting, Hng May
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Volume:
13
Language:
english
Journal:
Current Applied Physics
DOI:
10.1016/j.cap.2013.06.008
Date:
October, 2013
File:
PDF, 2.44 MB
english, 2013
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