Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads
Anand, T. Joseph Sahaya, Yau, Chua Kok, Leong, Yeow See, Keat, Lim Weng, Ting, Hng MayVolume:
13
Language:
english
Journal:
Current Applied Physics
DOI:
10.1016/j.cap.2013.06.008
Date:
October, 2013
File:
PDF, 2.44 MB
english, 2013