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[IEEE IEEE Symposium Conference Record Nuclear Science 2004. - Rome, Italy (16-22 Oct. 2004)] IEEE Symposium Conference Record Nuclear Science 2004. - A Fine Pitch Bump Bonding Process compatible with the Manufacture of the Pixel-HPD~s for the LHCb RICH Detector
Campbell, M., Aglieri-Rinella, G., Arnau-Izquierdo, G., Gys, T., Kanaya, N., Newby, C., Piedigrossi, D., Riedler, P., Salmi, J., Salonen, J., Savolainen-Pulli, S., Somerville, L., Suni, I., Vahanen, SVolume:
1
Year:
2004
Language:
english
DOI:
10.1109/NSSMIC.2004.1462278
File:
PDF, 2.00 MB
english, 2004