A Fine Pitch Bump Bonding Process Compatible With the...

IEEE Transactions on Nuclear Science 2006 / 08 Vol. 53; Iss. 4

A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector

Campbell, M., Rinella, G.A., Izquierdo, G.A., Gys, T., Kanaya, N., Newby, C., Piedigrossi, D., Riedler, P., Salmi, J., Salonen, J., Sav, S., Somerville, L., Suni, I., Vahanen, S., Wyllie, K.
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Volume:
53
Language:
english
Journal:
IEEE Transactions on Nuclear Science
DOI:
10.1109/TNS.2006.880537
Date:
August, 2006
File:
PDF, 3.50 MB
english, 2006
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