Dynamic solidification mechanism of ternary Ag-Cu-Ge...

SCIENCE CHINA Physics, Mechanics & Astronomy 2013 / 02 Vol. 56; Iss. 2

Dynamic solidification mechanism of ternary Ag-Cu-Ge eutectic alloy under ultrasonic condition

Wei Zhai, ZhenYu Hong, CeXiang Mei…
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
56
Language:
english
DOI:
10.1007/s11433-013-5004-x
Date:
February, 2013
File:
PDF, 2.32 MB
english, 2013
Conversion to is in progress
Conversion to is failed