Double-sided cooling for high power IGBT modules using flip...

IEEE Transactions on Components and Packaging Technologies 2001 / Dec. Vol. 24; Iss. 4

Double-sided cooling for high power IGBT modules using flip chip technology

Gillot, C., Schaeffer, C., Massit, C., Meysenc, L.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.974963
Date:
January, 2001
File:
PDF, 184 KB
english, 2001
Conversion to is in progress
Conversion to is failed