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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging
Wu, H. L. Henry, Lee, S. W. RickyYear:
2011
Language:
english
DOI:
10.1109/IMPACT.2011.6117173
File:
PDF, 667 KB
english, 2011