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[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Understanding effect of additives in copper electroplating filling for through silicon via
Miao, Min, Zhu, Yunhui, Bian, Yuan, Sun, Xin, Ma, Shenglin, Cui, Qinghu, Zhong, Xiao, Fang, Runiu, Chen, Jing, Jin, YufengYear:
2012
Language:
english
DOI:
10.1109/ICSICT.2012.6467713
File:
PDF, 342 KB
english, 2012