Thermal monitoring and testing of electronic systems

IEEE Transactions on Components and Packaging Technologies 1999 / 6 Vol. 22; Iss. 2

Thermal monitoring and testing of electronic systems

Szckely, V., Rencz, M., Pahi, A., Courtois, B.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.774737
Date:
June, 1999
File:
PDF, 177 KB
english, 1999
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