Pole-residue formulation for transient simulation of...

Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

Elzinga, M., Virga, K.L., Zhao, L., Prince, J.L.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.846624
Date:
May, 2000
File:
PDF, 113 KB
english, 2000
Conversion to is in progress
Conversion to is failed