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Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques
Elzinga, M., Virga, K.L., Zhao, L., Prince, J.L.Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.846624
Date:
May, 2000
File:
PDF, 113 KB
english, 2000