Mechanical Issues of Cu-to-Cu Wire Bonding

IEEE Transactions on Components and Packaging Technologies 2004 / 09 Vol. 27; Iss. 3

Mechanical Issues of Cu-to-Cu Wire Bonding

Chen, J., Degryse, D., Ratchev, P., DeWolf, I.
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Volume:
27
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2004.831745
Date:
September, 2004
File:
PDF, 1.54 MB
english, 2004
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