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[IEEE 2009 IEEE International Test Conference (ITC) - Austin, TX, USA (2009.11.1-2009.11.6)] 2009 International Test Conference - Testing 3D chips containing through-silicon vias

Marinissen, Erik Jan, Zorian, Yervant
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Year:
2009
Language:
english
DOI:
10.1109/TEST.2009.5355573
File:
PDF, 569 KB
english, 2009
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