Fixed Wand Electronic Flame-Off for Ball Formation in the...

Journal of Electronic Packaging 1994 Vol. 116; Iss. 3

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Qin, Wei, Cohen, Ira M., Ayyaswamy, P. S.
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Volume:
116
Year:
1994
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905688
File:
PDF, 654 KB
english, 1994
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