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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Roadmap of reliability: Methodology and application in Guangdong’s lead-free technology
Xiaoyan Li,, Ling Wang,, Yonggao Fu,, Lu Zeng,Year:
2008
Language:
english
DOI:
10.1109/ICEPT.2008.4607095
File:
PDF, 444 KB
english, 2008