Flip-Chip-Assembled Air-Suspended Inductors

IEEE Transactions on Advanced Packaging 2007 / 02 Vol. 30; Iss. 1

Flip-Chip-Assembled Air-Suspended Inductors

Bell, P.J., Hoivik, N.D., Saravanan, R.A., Ehsan, N., Bright, V.M., Popovic, Z.
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2006.890227
Date:
February, 2007
File:
PDF, 2.12 MB
english, 2007
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