Low temperature transient liquid phase bonding of Au/Sn and...

Microsystem Technologies 2013 / 08 Vol. 19; Iss. 8

Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging

S. Marauska, M. Claus, T. Lisec, B. Wagner
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Volume:
19
Language:
english
DOI:
10.1007/s00542-012-1708-5
Date:
August, 2013
File:
PDF, 1.60 MB
english, 2013
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