Characterization of bonded wafer stacks by use of the...

Characterization of bonded wafer stacks by use of the photoelastic-analysis-method

H. Geiler, K. Schulz, R. Knechtel
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Volume:
19
Language:
english
DOI:
10.1007/s00542-013-1748-5
Date:
May, 2013
File:
PDF, 718 KB
english, 2013
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