[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - Thermal-mechanical simulation of embedded module based on organic substrate
Xia Zhang,, Chan, J., Liqiang Cao,, Fengze Hou,, Hongwen He,, Lixi Wan,Year:
2013
Language:
english
DOI:
10.1109/ISAPM.2013.6510396
File:
PDF, 1.62 MB
english, 2013