Architectured Materials to Improve the Reliability of Power...

Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder

Abderrahmen Kaabi, Yves Bienvenu, David Ryckelynck…
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Volume:
43
Language:
english
DOI:
10.1007/s11664-013-2662-4
Date:
March, 2014
File:
PDF, 1015 KB
english, 2014
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