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Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board
Chih-Kai Huang, Keh-Wen Lin, Yu-Ming Huang…Volume:
42
Language:
english
DOI:
10.1007/s11664-013-2609-9
Date:
August, 2013
File:
PDF, 1.14 MB
english, 2013