A Study on the Physical Properties and Interfacial...

Journal of Electronic Materials 2013 / 08 Vol. 42; Iss. 8

A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder

Hai-Tao Ma, Jie Wang, Lin Qu, Ning Zhao, A. Kunwar
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Volume:
42
Language:
english
DOI:
10.1007/s11664-013-2615-y
Date:
August, 2013
File:
PDF, 1.49 MB
english, 2013
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