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Properties of Thermal Conductivity on Polyimide/Clay Nanocomposite Foams
Kim, Eunk Young, Jeong, Seung Yong, Shin, Gyo Jic, Lee, Sang Kug, Choi, Kyung HoVolume:
229-231
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/AMM.229-231.215
Date:
November, 2012
File:
PDF, 460 KB
english, 2012