Low temperature Si/Si wafer direct bonding using a plasma...

Low temperature Si/Si wafer direct bonding using a plasma activated method

Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang…
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Volume:
14
Language:
english
DOI:
10.1631/jzus.C12MNT02
Date:
April, 2013
File:
PDF, 890 KB
english, 2013
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