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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Microwave Curing of Materials for High Density Packaging
Goussetis, G., Sinclair, K.I., Sangster, A.J., Desmulliez, M.P.Y., Tilford, T., Parrott, A.K, Bailey, C.Year:
2007
Language:
english
DOI:
10.1109/HDP.2007.4283552
File:
PDF, 129 KB
english, 2007