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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Analysis of signal integrity/power integrity in multilayer printed circuit board and two improving methods
Hee-do Kang,, Hyun Kim,, Jong-Gwan Yook,Year:
2008
Language:
english
DOI:
10.1109/EDAPS.2008.4736037
File:
PDF, 771 KB
english, 2008