[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J., Wunderle, B., Kumar, S. G., Hoelck, O., Walter, H., Wittler, O., Engelmann, G., Wolf, M. J., Beer, G., Pressel, K.Year:
2013
Language:
english
DOI:
10.1109/EuroSimE.2013.6529943
File:
PDF, 4.69 MB
english, 2013