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Chip on Board 3–10-GHz Impulse Radio Ultra Wideband Transmitter With Optimized Die to Antenna Wire Bond Transition
Fourquin, O., Bourdel, S., Gaubert, J., Vauche, R., Dehaese, N., Chami, A., Dauvignac, J., Kossiavas, G., Fortino, N., Brachat, P.Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2231466
Date:
May, 2013
File:
PDF, 1.64 MB
english, 2013