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Packaging of Single-Component Fractional Order Element
Mondal, Debasmita, Biswas, KarabiVolume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2012.2212020
Date:
March, 2013
File:
PDF, 1001 KB
english, 2013