Bump and Underfill Effects on Thermal Behaviors of...

IEEE Transactions on Device and Materials Reliability 2014 / 03 Vol. 14; Iss. 1

Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

Tsai, Ming-Yi, Tang, Chung-Yi, Yen, Chia-Yi, Chang, Liann-Be
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Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2013.2248365
Date:
March, 2014
File:
PDF, 961 KB
english, 2014
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