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An integrated circuit with transmit beamforming flip-chip...

IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 2009 / 10 Vol. 56; Iss. 10

An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

Wygant, I., Jamal, N., Lee, H., Nikoozadeh, A., Oralkan, O., Karaman, M., Khuri-yakub, B.
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Volume:
56
Language:
english
Journal:
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
DOI:
10.1109/TUFFC.2009.1297
Date:
October, 2009
File:
PDF, 1.36 MB
english, 2009
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