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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Reliability of Nano-Structured Nickel Interconnections Replacing FlipChip Solder Assembly without Underfill
Aggarwal, Ankur, Raj, P. Markondeya, Lee, Baik-Woo, Yim, Myung Jin, Tambawala, Abdemanaf, Iyer, Mahadevan, Swaminathan, Madhavan, Wong, C. P., Tummala, RaoYear:
2007
Language:
english
DOI:
10.1109/ECTC.2007.373906
File:
PDF, 4.99 MB
english, 2007