A Rigorous Model for Through-Silicon Vias With Ohmic...

IEEE Microwave and Wireless Components Letters 2013 / 08 Vol. 23; Iss. 8

A Rigorous Model for Through-Silicon Vias With Ohmic Contact in Silicon Interposer

Yang, De-Cao, Xie, Jianyong, Swaminathan, Madhavan, Wei, Xing-Chang, Li, Er-Ping
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Volume:
23
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2013.2270459
Date:
August, 2013
File:
PDF, 708 KB
english, 2013
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