Einsatz physikalischer Analysemethoden zur...

Einsatz physikalischer Analysemethoden zur Charakterisierung von dünnen Schichten und Grenzflächen in der Halbleiterindustrie. Application of physical analysis techniques for thin film and interface characterization in semiconductor industry

Ehrenfried Zschech, Eckhard Langer, Hans-Jürgen Engelmann, Kornelia Dittmar, Werner Blum
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Volume:
13
Year:
2001
Pages:
8
DOI:
10.1002/1522-2454(200101)13:13.0.co;2-6
File:
PDF, 374 KB
2001
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