Determination of Thermal Fatigue Delamination of Die Attach...

IEEE Photonics Technology Letters 2012 / 03 Vol. 24; Iss. 5

Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

Zhang, Guangchen, Feng, Shiwei, Zhu, Hui, liu, Jing, Li, Jingwan, Guo, Chunsheng
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Volume:
24
Language:
english
Journal:
IEEE Photonics Technology Letters
DOI:
10.1109/LPT.2011.2179925
Date:
March, 2012
File:
PDF, 373 KB
english, 2012
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