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Microstructure and mechanical properties of transient liquid phase bonding of /Al nanocomposite using copper interlayer
Sayyedain, S.S., Salimijazi, H.R., Toroghinejad, M.R., Karimzadeh, F.Volume:
53
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2013.06.074
Date:
January, 2014
File:
PDF, 3.89 MB
english, 2014