[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Vibration Simulation of Transducer System in Thermosonic Wire bonding
zhili, Long, lei, Han, hongquan, Zhou, yunxin, Wu, Jue, ZhongYear:
2006
Language:
english
DOI:
10.1109/HDP.2005.251439
File:
PDF, 526 KB
english, 2006