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[IEEE 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Taipei, Taiwan (2013.01.20-2013.01.24)] 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - CMOS-based thermopiles using vertically integrated double polycrystalline silicon layers
Zhou, Huchuan, Kropelnicki, P., Tsai, Julius Minglin, Lee, ChengkuoYear:
2013
Language:
english
DOI:
10.1109/MEMSYS.2013.6474270
File:
PDF, 669 KB
english, 2013