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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Power dissipation analysis for different configurations of TSVs at high (GHz) frequencies
Singh, Aditya Vikram, Chaturvedi, Divanshu, Singh, Shiv Govind, Khan, Mohammed Zafar AliYear:
2013
Language:
english
DOI:
10.1109/ECTC.2013.6575913
File:
PDF, 901 KB
english, 2013