Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Modeling of Through-Silicon Vias (TSV) in 3D Integration
Li, Er-PingVolume:
10.1002/97
Year:
2012
Language:
english
DOI:
10.1002/9781118166727.ch6
File:
PDF, 326 KB
english, 2012