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SPIE Proceedings [SPIE Photonics Asia 2010 - Beijing, China (Monday 18 October 2010)] High-Power Lasers and Applications V - Pulsed Nd:YAG laser cutting of silicon wafer by controlled fracture technique
Liu, Jian, Lu, Jian, Ni, Xiaowu, Dai, Gang, Zhang, Liang, Singh, Upendra N., Fan, Dianyuan, Yao, Jianquan, Walter, Robert F.Volume:
7843
Year:
2010
Language:
english
DOI:
10.1117/12.868907
File:
PDF, 995 KB
english, 2010