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SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III - Mechanical stress and electromigration in an aluminum meander structure
Yu, Xiaoying, Weide, Kirsten, Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-DieterVolume:
3216
Year:
1997
Language:
english
DOI:
10.1117/12.284698
File:
PDF, 180 KB
english, 1997