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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Effect of Wire Purity on Copper Wire Bonding

Srikanth, Narasimalu, Premkumar, J., Sivakumar, M., Wong, Y. M., Vath, C. J.
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Year:
2007
Language:
english
DOI:
10.1109/EPTC.2007.4469764
File:
PDF, 500 KB
english, 2007
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