[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Design and simulation of a package solution for millimeter wave MEMS switch
Yu, Wencai, Liao, XiaopingYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270763
File:
PDF, 742 KB
english, 2009