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Thermal Cycling Aging Effect on the Reliability and Morphological Evolution of SnAgCu Solder Joints
Teo, J. W. RonnieVolume:
30
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/TEPM.2007.907575
Date:
October, 2007
File:
PDF, 3.85 MB
english, 2007