Low temperature adhesion bonding for BioMEMS

Journal of Micromechanics and Microengineering 2006 / 04 Vol. 16; Iss. 4

Low temperature adhesion bonding for BioMEMS

Kentsch, Jörg, Breisch, Stefanie, Stelzle, Martin
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Volume:
16
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/16/4/017
Date:
April, 2006
File:
PDF, 912 KB
english, 2006
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