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[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - A study on the effect of mold compound moisture related properties and leadframe dimension on the reliability of IC packages using an integrated mechanical modeling approach
Chin, SK, Erfe, EricYear:
2010
Language:
english
DOI:
10.1109/IEMT.2010.5746691
File:
PDF, 1.13 MB
english, 2010