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[IEEE Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (18-19 Oct. 1999)] Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) - The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages
Coyle, R.J., Holliday, A., Mescher, P., Solan, P.P., Gahr, S.A., Cyker, H.A., Dorey, K., Ejim, T.I.Year:
1999
Language:
english
DOI:
10.1109/IEMT.1999.804792
File:
PDF, 1.74 MB
english, 1999