[IEEE 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) - Paris, France (2012.01.29-2012.02.2)] 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) - CMOS integrated silicon/glass-bonded 3D force/torque sensor
Handwerker, J., Gieschke, P., Baumann, M., Paul, O.Year:
2012
Language:
english
DOI:
10.1109/MEMSYS.2012.6170112
File:
PDF, 3.21 MB
english, 2012