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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Novel design and reliability assessment of a 3D DRAM stacking based on Cu-Sn micro-bump bonding and TSV interconnection technology
Li, Cao, Wang, Xuefang, Chen, Mingxiang, Zhou, Shengjun, Lv, Yaping, Liu, ShengYear:
2013
Language:
english
DOI:
10.1109/ECTC.2013.6575831
File:
PDF, 1.19 MB
english, 2013