[IEEE 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) - Paris, France (2012.01.29-2012.02.2)] 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) - High yield packaging for high-density multi-channel chip integration on flexible parylene substrate
Chang, Jay Han-Chieh, Kang, Dongyang, Tai, Yu-ChongYear:
2012
Language:
english
DOI:
10.1109/MEMSYS.2012.6170160
File:
PDF, 1.70 MB
english, 2012