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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Epoxy/h-BN composites for thermally conductive underfill material
Liang, Qizhen, Xiu, Yonghao, Lin, Wei, Moon, Kyoung-Sik, Wong, C. P.Year:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074050
File:
PDF, 785 KB
english, 2009